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參數(shù)資料
| 型號(hào)： | FMM5826X |
| 廠商： | SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC. |
| 英文描述： | Ka-Band Power Amplifier MMIC |
| 中文描述： | Ka波段單片功率放大器 |
| 文件頁(yè)數(shù)： | 12/13頁(yè) |
| 文件大小： | 417K |
| 代理商： | FMM5826X |
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DIE ATTACH
1) The die-attach station must have accurate temperature control and an inert forming gas should
be used.
2) Chips should be kept at room temperature except during die-attach.
3) Place package or carrier on the heated stage.
4) Lightly grasp the chip edges by the longer side using tweezers.
Die attach conditions
Stage Temperature : 300 to 310
℃
Time : less than 15 seconds
AuSn Preform Volume : per next Figure
■
WIRE BONDING
The bonding equipment must be properly grounded. The following or equivalent equipment, tools,
materials, and conditions are recommended.
1) Bonding Equipment and Bonding Tool.
Bonding Equipment : West Bond Model 7400 (Manual Bonder)
Bonding Tool : CCOD-1/16-S-437-60-F-2010-MP (Deweyl)
2) Bonding Wire
Material : Hard or Half hard gold
Diameter : 0.7 to 1.0 mil
3) Bonding Conditions
Method : Thermal Compression Bonding with Ultrasonic Power
Tool Force : 0.196 N ± 0.0196 N
Stage Temperature : 215
Tool Heater : None
Ultrasonic Power Transmitter : West Bond Model 1400
Duration : 150 mS/Bond
℃
± 5
℃
0
500
1000
1500
2000
2500
0
2
4
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20
Area of Chip Back Surface (mm^2)
V
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3
)
Ka-Band Power Amplifier MMIC
FMM5826X
FMM5826X
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