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參數(shù)資料
| 型號(hào)： | ISP1362 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Single-chip Universal Serial Bus On-The-Go controller |
| 中文描述： | 單芯片通用串行總線和On - The - Go控制器 |
| 文件頁(yè)數(shù)： | 147/150頁(yè) |
| 文件大小： | 647K |
| 代理商： | ISP1362 |
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Philips Semiconductors
ISP1362
Single-chip USB OTG controller
Product data
Rev. 03
—
06 January 2004
147 of 150
9397 750 12337
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
[3]
These transparent plastic packages are extremely sensitive to re
fl
ow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared re
fl
ow
soldering with peak temperature exceeding 217
°
C
±
10
°
C measured in the atmosphere of the re
fl
ow
oven. The package body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is de
fi
nitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is de
fi
nitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on
fl
ex foil. However, the image sensor package can be mounted by the client on a
fl
ex
foil by using a hot bar soldering process. The appropriate soldering pro
fi
le can be provided on
request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
[4]
[5]
[6]
[7]
[8]
[9]
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| ISP1362BD | Single-chip Universal Serial Bus On-The-Go controller |
| ISP1362EE | Single-chip Universal Serial Bus On-The-Go controller |
| ISP1501 | Hi-Speed Universal Serial Bus peripheral transceiver |
| ISP1520 | Hi-Speed Universal Serial Bus hub controller |
| ISP1520BD | Hi-Speed Universal Serial Bus hub controller |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ISP1362BD | 功能描述:USB 接口集成電路 USB OTG CONTROLLER RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20 |
| ISP1362BD,118 | 功能描述:USB 接口集成電路 USB OTG CONTROLLER RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20 |
| ISP1362BD,151 | 功能描述:USB 接口集成電路 USB OTG CONTROLLER RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20 |
| ISP1362BD,157 | 功能描述:USB 接口集成電路 USB OTG CONTROLLER RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20 |
| ISP1362BD157 | 制造商:NXP Semiconductors 功能描述:IC CONTROLLER USB-OTG 64LQFP 制造商:ST-Ericsson 功能描述:IC CONTROLLER USB OTG 64-LQFP |
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