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參數資料
| 型號： | LFX125EB-03F256C |
| 廠商： | Lattice Semiconductor Corporation |
| 文件頁數： | 87/119頁 |
| 文件大小： | 0K |
| 描述： | IC FPGA 139K GATES 256-BGA |
| 標準包裝： | 90 |
| 系列： | ispXPGA® |
| 邏輯元件/單元數： | 1936 |
| RAM 位總計： | 94208 |
| 輸入/輸出數： | 160 |
| 門數： | 139000 |
| 電源電壓： | 2.3 V ~ 3.6 V |
| 安裝類型： | 表面貼裝 |
| 工作溫度： | 0°C ~ 85°C |
| 封裝/外殼： | 256-BGA |
| 供應商設備封裝： | 256-FPBGA（17x17） |
| 其它名稱： | 220-1237 |
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Lattice Semiconductor
ispXPGA Family Data Sheet
3
Architecture Overview
The ispXPGA architecture is a symmetrical architecture consisting of an array of Programmable Function Units
(PFUs) enclosed by Input Output Groups (PICs) with columns of sysMEM Embedded Block RAMs (EBRs) distrib-
uted throughout the array. Figure 1 illustrates the ispXPGA architecture. Each PIC has two corresponding sysIO
blocks, each of which includes one input and output buffer. On two sides of the device, between the PICs and the
sysIO blocks, there are sysHSI High-Speed Interface blocks. The symmetrical architecture allows designers to eas-
ily implement their designs, since any logic function can be placed in any section of the device.
The PFUs contain the basic building blocks to create logic, memory, arithmetic, and register functions. They are
optimized for speed and flexibility allowing complex designs to be implemented quickly and efficiently.
The PICs interface the PFUs and EBRs to the external pins of the device. They allow the signals to be registered
quickly to minimize setup times for high-speed designs. They also allow connections directly to the different logic
elements for fast access to combinatorial functions.
The sysMEM EBRs are large, fast memory elements that can be configured as RAM, ROM, FIFO, and other stor-
age types. They are designed to facilitate both single and dual-port memory for high-speed applications.
These three components of the architecture are interconnected via a high-speed, flexible routing array. The routing
array consists of Variable Length Interconnect (VLI) lines between the PICs, PFUs, and EBRs. There is additional
routing available to the PFU for feedback and direct routing of signals to adjacent PFUs or PICs.
The sysIO blocks consist of configurable input and output buffers connected directly to the PICs. These buffers can
be configured to interface with 16 different I/O standards. This allows the ispXPGA to interface with other devices
without the need for external transceivers.
The sysHSI blocks provide the necessary components to allow the ispXPGA device to transfer data at up to
800Mbps using the LVDS standard. These components include serializing, de-serializing, and clock data recovery
(CDR) logic.
The sysCLOCK blocks provide clock multiplication/division, clock distribution, delay compensation, and increased
performance through the use of PLL circuitry that manipulates the global clocks. There is one sysCLOCK block for
each global clock tree in the device.
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相關代理商/技術參數 |
參數描述 |
|---|---|
| LFX125EB-03F256I | 功能描述:FPGA - 現場可編程門陣列 139K Gates, 160 I/O 2.5/3.3V, -3 speed RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數量: 邏輯塊數量:943 內嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256 |
| LFX125EB-03F516C | 功能描述:FPGA - 現場可編程門陣列 139K 176 I/O ispJTAG RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數量: 邏輯塊數量:943 內嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256 |
| LFX125EB-03F516I | 功能描述:FPGA - 現場可編程門陣列 139K 176 I/O ispJTAG RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數量: 邏輯塊數量:943 內嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256 |
| LFX125EB-03FH516C | 功能描述:FPGA - 現場可編程門陣列 Use LFX125EB-03F516C RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數量: 邏輯塊數量:943 內嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256 |
| LFX125EB-03FH516I | 功能描述:FPGA - 現場可編程門陣列 Use LFX125EB-03F516I RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數量: 邏輯塊數量:943 內嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256 |
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