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參數(shù)資料
| 型號(hào)： | MPC603E7TEC |
| 廠商： | Motorola, Inc. |
| 英文描述： | PowerPC 603e RISC Microprocessor |
| 中文描述： | RISC微處理器的PowerPC 603e |
| 文件頁數(shù)： | 28/36頁 |
| 文件大小： | 551K |
| 代理商： | MPC603E7TEC |
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PID7t-603e Hardware Specifications
System Design Information
The board designer can choose between several types of heat sinks to place on the 603e. There are several
commercially-available heat sinks for the 603e provided by the following vendors:
Chip Coolers Inc.
333 Strawberry Field Rd.
Warwick, RI 02887-6979
Internet: www.chipcoolers.com
800-227-0254 (USA/Canada)
401-739-7600
International Electronic Research Corporation (IERC)818-842-7277
135 W. Magnolia Blvd.
Burbank, CA 91502
Internet: www.ctscorp.com
Thermalloy
2021 W. Valley View Lane
Dallas, TX 75234-8993
Internet: www.thermalloy.com
972-243-4321
WakeTeld Engineering
100 Cummings Center, Suite 157H
Beverly, MA 01915
Internet: www.wakeTeld.com
781-406-3000
Aavid Engineering
250 Apache Trail
Terrell, TX 75160
Internet: www.aavid.com
Ultimately, the Tnal selection of an appropriate heat sink depends on many factors, such as thermal
performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost.
972-551-7330
1.8.6.1 Internal Package Conduction Resistance
For this packaging technology the intrinsic thermal conduction resistance (shown in Table 3) versus the
external thermal resistance paths are shown in Figure 16 for a package with an attached heat sink mounted
to a printed-circuit board.
F
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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