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參數資料
| 型號： | MPC603E7TEC |
| 廠商： | Motorola, Inc. |
| 英文描述： | PowerPC 603e RISC Microprocessor |
| 中文描述： | RISC微處理器的PowerPC 603e |
| 文件頁數： | 29/36頁 |
| 文件大小： | 551K |
| 代理商： | MPC603E7TEC |
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PID7t-603e Hardware Specifications
For More Information On This Product,
Go to: www.freescale.com
29
System Design Information
Figure 16. Package with Heat Sink Mounted to a Printed-Circuit Board
1.8.6.2 Thermal Interface Materials
A thermal interface material is recommended at the package lid-to-heat sink interface to minimize the
thermal contact resistance. For those applications where the heat sink is attached by spring clip mechanism,
Figure 17 shows the thermal performance of three thin-sheet thermal-interface materials (silicone,
graphite/oil, oroether oil), a bare joint, and a joint with thermal grease as a function of contact pressure.
As shown, the performance of these thermal interface materials improves with increasing contact pressure.
The use of thermal grease signiTcantly reduces the interface thermal resistance. That is, the bare joint results
in a thermal resistance approximately 7 times greater than the thermal grease joint. Therefore, the synthetic
grease offers the best thermal performance, considering the low interface pressure. Of course, the selection
of any thermal interface material depends on many factorsthermal performance requirements,
manufacturability, service temperature, dielectric properties, cost, etc.
External Resistance
External Resistance
Internal Resistance
(Note the internal versus external package resistance)
Radiation
Convection
Radiation
Convection
Heat Sink
Printed-Circuit Board
Thermal Interface Material
Package/Leads
Die Junction
Die/Package
F
Freescale Semiconductor, Inc.
n
.
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