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參數資料
| 型號： | MPC603E7TEC |
| 廠商： | Motorola, Inc. |
| 英文描述： | PowerPC 603e RISC Microprocessor |
| 中文描述： | RISC微處理器的PowerPC 603e |
| 文件頁數： | 33/36頁 |
| 文件大小： | 551K |
| 代理商： | MPC603E7TEC |
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PID7t-603e Hardware Specifications
For More Information On This Product,
Go to: www.freescale.com
33
Ordering Information
design and its operating conditions. In addition to the component's power consumption, a number of factors
affect the Tnal operating die-junction temperatureairow, board population (local heat ux of adjacent
components), heat sink efTciency, heat sink attach, heat sink placement, next-level interconnect technology,
system air temperature rise, altitude, etc.
Due to the complexity and the many variations of system-level boundary conditions for today's
microelectronic equipment, the combined effects of the heat transfer mechanisms (radiation, convection and
conduction) may vary widely. For these reasons, we recommend using conjugate heat transfer models for
the board, as well as, system-level designs. To expedite system-level thermal analysis, several òcompactó
thermal-package models are available within FLOTHERM¨. These are available upon request.
1.9 Ordering Information
Figure 19 provides the part numbering nomenclature for the PID7t-603e. Note that the individual part
numbers correspond to a maximum processor core frequency. For available frequencies, contact your local
Motorola sales ofTce.
In addition to the processor frequency, the part numbering scheme also consists of a part modiTer and
application modiTer. The part modiTer indicates any enhancement(s) in the part from the original design.
The application modiTer may specify special bus frequencies or application conditions. Each part number
also contains a revision code. This refers to the die mask revision number and is speciTed in the part
numbering scheme for identiTcation purposes only.
Figure 19. Part Number Key
MPC 603 R RX XXX X X
Product Code
Part Identifier
Part Modifier
(R = Remapped, Enhanced, Low-Voltage)
Application Modifier
(L = Any Valid PLL Configuration)
(T = Extended Termperature Range)
Package
(RX = CBGA without Lid)
(ZT = PBGA Package)
Processor Frequency
(Contact Motorola Sales Office)
Revision Level
F
Freescale Semiconductor, Inc.
n
.
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