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參數資料
| 型號： | S29GL016A10FAI020 |
| 廠商： | SPANSION LLC |
| 元件分類： | PROM |
| 英文描述： | 1M X 16 FLASH 3V PROM, 100 ns, PBGA64 |
| 封裝： | 13 X 11 MM, FBGA-64 |
| 文件頁數： | 13/95頁 |
| 文件大小： | 3585K |
| 代理商： | S29GL016A10FAI020 |
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20
S29GL-A
S29GL-A_00_A12 May 21, 2008
Da ta
Sh e e t
6.2
S29GL032A Standard Products
Standard products are available in several packages and operating ranges. The order number (Valid
Combination) is formed by a combination of the following:
Notes
1. Type 0 is standard. Specify others as required: TSOPs can be packed in Types 0 and 3; BGAs can be packed in Types 0, 2, or 3.
2. TSOP package marking omits packing type designator from ordering part number.
3. BGA package marking omits leading S29 and packing type designator from ordering part number.
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult your local
sales office to confirm availability of specific valid combinations and to check on newly released
combinations.
S29GL032A
90
T
A
I
R1
0
Packing Type
0= Tray
2
= 7-inch Tape and Reel
3
= 13-inch Tape and Reel
Model Number
R1 = x8/x16, VCC=3.0 – 3.6 V, Uniform sector device, highest address sector protected
when WP#/ACC=VIL
R2 = x8/x16, VCC=3.0 – 3.6 V, Uniform sector device, lowest address sector protected
when WP#/ACC=VIL
R3 = x8/x16, VCC=3.0 – 3.6 V, Top boot sector device, top two address sectors
protected when WP#/ACC=VIL
R4 = x8/x16, VCC=3.0 – 3.6 V, Bottom boot sector device, bottom two address sectors
protected when WP#/ACC=VIL
W3= x16, VCC=2.7 – 3.6 V, 56-ball FBGA, top boot sector device *
W4= x16, VCC=2.7 – 3.6 V, 56-ball FBGA, bottom boot sector device*
*W3 and W4 are MCP-compatible packages for cellular handsets only
Temperature Range
I
= Industrial (–40°C to +85°C)
Package Material Set
A = Standard
F
= Pb-Free
Package Type
T
= Thin Small Outline Package (TSOP) Standard Pinout
B = Fine-pitch Ball-Grid Array Package
F
= Fortified Ball-Grid Array Package
Speed Option
See Product Selector Guide on page 9 and Valid Combinations below
Device Number/Description
S29GL032A
32 Megabit Page-Mode Flash Memory Manufactured using 200 nm MirrorBit Process Technology, 3.0 Volt-only Read,
Program, and Erase
Table 6.2 S29GL032A Ordering Options
S29GL032A Valid Combinations
Package Description
(Notes)
Device
Number
Speed
Option
Package, Material,
& Temperature
Range
Model
Number
Packin
g
Type
S29GL032A
90, 10, 11
TAI,TFI
R1, R2
0,2,3
TS056 (Note 2)
TSOP
FAI,FFI
LAA064 (Note 3)
Fortified BGA
TAI,TFI
R3,R4
TS048 (Note 2)
TSOP
BAI,BFI
VBK048 (Note 3)
Fine-Pitch BGA
FAI,FFI
LAA064 (Note 3)
Fortified BGA
10, 11
BAI,BFI
W3,W4
VBU056 (Note 3)
Fine-Pitch BGA (For cellular handsets only)
相關PDF資料 |
PDF描述 |
|---|---|
| S29GL032A10TAIR10 | 64 MEGABIT 32MEGABIT 3.0 BOLT ONLY PAGE MODE FLASH MEMORY |
| S29GL032A10TAIR12 | 64 MEGABIT 32MEGABIT 3.0 BOLT ONLY PAGE MODE FLASH MEMORY |
| S29GL032A10TAIR13 | 64 MEGABIT 32MEGABIT 3.0 BOLT ONLY PAGE MODE FLASH MEMORY |
| S29GL032A10TAIR20 | 64 MEGABIT 32MEGABIT 3.0 BOLT ONLY PAGE MODE FLASH MEMORY |
| S29GL032A10TAIR22 | 64 MEGABIT 32MEGABIT 3.0 BOLT ONLY PAGE MODE FLASH MEMORY |
相關代理商/技術參數 |
參數描述 |
|---|---|
| S29GL016A10FAIR10 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:64 Megabit, 32 Megabit, and 16 Megabit 3.0-Volt only Page Mode Flash Memory Featuring 200 nm MirrorBit Process Technology |
| S29GL016A10FAIR12 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:64 Megabit, 32 Megabit, and 16 Megabit 3.0-Volt only Page Mode Flash Memory Featuring 200 nm MirrorBit Process Technology |
| S29GL016A10FAIR13 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:64 Megabit, 32 Megabit, and 16 Megabit 3.0-Volt only Page Mode Flash Memory Featuring 200 nm MirrorBit Process Technology |
| S29GL016A10FAIR20 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:S29GL-A MirrorBit Flash Family |
| S29GL016A10FAIR22 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:64 Megabit, 32 Megabit, and 16 Megabit 3.0-Volt only Page Mode Flash Memory Featuring 200 nm MirrorBit Process Technology |
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