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參數資料
| 型號： | S29GL016A10FAI020 |
| 廠商： | SPANSION LLC |
| 元件分類： | PROM |
| 英文描述： | 1M X 16 FLASH 3V PROM, 100 ns, PBGA64 |
| 封裝： | 13 X 11 MM, FBGA-64 |
| 文件頁數： | 91/95頁 |
| 文件大小： | 3585K |
| 代理商： | S29GL016A10FAI020 |
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May 21, 2008 S29GL-A_00_A12
S29GL-A
91
Data
She e t
18.4
VBN048—48-Ball Fine-pitch Ball Grid Array (BGA) 10x 6 mm Package
3425\ 16-038.25
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT
AS NOTED).
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
"D" DIRECTION.
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF SOLDER BALLS.
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
8. NOT USED.
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
PACKAGE
VBN 048
JEDEC
N/A
10.00 mm x 6.00 mm NOM
PACKAGE
SYMBOL
MIN
NOM
MAX
NOTE
A
---
1.00
OVERALL THICKNESS
A1
0.17
---
BALL HEIGHT
A2
0.62
---
0.73
BODY THICKNESS
D
10.00 BSC.
BODY SIZE
E
6.00 BSC.
BODY SIZE
D1
5.60 BSC.
BALL FOOTPRINT
E1
4.00 BSC.
BALL FOOTPRINT
MD
8
ROW MATRIX SIZE D DIRECTION
ME
6
ROW MATRIX SIZE E DIRECTION
N
48
TOTAL BALL COUNT
φb
0.35
---
0.45
BALL DIAMETER
e
0.80 BSC.
BALL PITCH
SD / SE
0.40 BSC.
SOLDER BALL PLACEMENT
NONE
DEPOPULATED SOLDER BALLS
+0.20
-0.50
1.00
-0.50
+0.20
1.00
0.50
SEATING PLANE
A1 ID.
A1 CORNER
A2
A
b
e
D
E
B
A
M
0.15
C
M
7
6
e
SE
SD
C
0.10
A1
C
6
5
4
3
2
A
B
C
D
E
F
G
1
H
B
A
C
0.08
E1
D1
C
0.08
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