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參數資料
| 型號： | TFP401AMPZPEP |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 消費家電 |
| 英文描述： | SPECIALTY CONSUMER CIRCUIT, PQFP100 |
| 封裝： | 14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, HTQFP-100 |
| 文件頁數： | 8/21頁 |
| 文件大?。?/td> | 460K |
| 代理商： | TFP401AMPZPEP |
SLDS160 – MARCH 2009 .................................................................................................................................................................................................. www.ti.com
Soldering the back side pad of the device to a thermal land connected to the PCB ground plane is recommended
for electrical and EMI considerations. The thermal land may be soldered to the exposed PowerPAD using
standard reflow soldering techniques.
The recommended pad size for the grounded thermal land is 5.6mm sq. minimum, centered in the device land
pattern. When vias are required to ground the land, multiple vias are recommended for a low impedance
connection to the ground plane. Vias in the exposed pad should be small enough or filled to prevent wicking the
solder away from the interface between the package body and the thermal land on the surface of the board
during solder reflow.
More information on this package and other requirements for using thermal lands and thermal vias are detailed in
the TI application report PowerPAD Thermally Enhanced Package Application Report, TI literature number
SLMA002, available via the TI Web pages beginning at www.ti.com.
Table 1 outlines the thermal properties of the TI 100-TQFP PowerPAD package. The 100-TQFP
non-PowerPAD package is included only for reference.
Table 1. TI 100-TQFP (14 X 14 X 1 mm)/0.5 mm LEAD PITCH
PowerPAD
WITHOUT
PARAMETER(1)(2)
NOT CONNECTED TO PCB
CONNECTED TO PCB
PowerPAD
THERMAL PLANE
THERMAL PLANE(1)
Theta-JA
45°C/W
27.3°C/W
17.3°C/W
Theta-JC
3.11°C/W
0.12°C/W
Maximum power dissipation(3)
1.6 W
2.7 W
4.3 W
(1)
Specified with 2-oz. Cu PCB plating.
(2)
Airflow is at 0 LFM (no airflow)
(3)
Measured at ambient temperature, TA = 70°C.
16
Copyright 2009, Texas Instruments Incorporated
Product Folder Link(s): TFP401A-EP
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| TFP401APZP | 功能描述:顯示接口集成電路 PanelBus DVI Rcvr 165MHz HSYNC fix RoHS:否 制造商:Texas Instruments 電源電流:125 mA 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:WQFN-60 封裝:Reel |
| TFP401APZPG4 | 功能描述:顯示接口集成電路 PanelBus DVI Rcvr RoHS:否 制造商:Texas Instruments 電源電流:125 mA 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:WQFN-60 封裝:Reel |
| TFP401PZP | 功能描述:顯示接口集成電路 PanelBus DVI Receiver 165MHz RoHS:否 制造商:Texas Instruments 電源電流:125 mA 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:WQFN-60 封裝:Reel |
| TFP401PZPG4 | 功能描述:顯示接口集成電路 PanelBus DVI Rcvr RoHS:否 制造商:Texas Instruments 電源電流:125 mA 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:WQFN-60 封裝:Reel |
| TFP403 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:TI PANEBUS DIGITAL RECEIVER |
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