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參數資料
| 型號： | THS8083APZP |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 消費家電 |
| 英文描述： | SPECIALTY CONSUMER CIRCUIT, PQFP100 |
| 封裝： | GREEN, PLASTIC, HTQFP-100 |
| 文件頁數： | 58/63頁 |
| 文件大小： | 320K |
| 代理商： | THS8083APZP |
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PACKAGE OPTION ADDENDUM
www.ti.com
7-Jan-2011
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
THS8083APZP
OBSOLETE
HTQFP
PZP
100
TBD
Call TI
Samples Not Available
THS8083APZPG4
OBSOLETE
HTQFP
PZP
100
TBD
Call TI
Samples Not Available
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
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相關代理商/技術參數 |
參數描述 |
|---|---|
| THS8083APZP | 制造商:Texas Instruments 功能描述:8BIT ADC 80MSPS TRIPLE SMD 8083 |
| THS8083APZPG4 | 功能描述:視頻模擬/數字化轉換器集成電路 Tr 8B 95MSPS 3.3V Vid & Graphics Dig RoHS:否 制造商:Texas Instruments 輸入信號類型:Differential 轉換器數量:1 ADC 輸入端數量:4 轉換速率:3 Gbps 分辨率:8 bit 結構: 輸入電壓:3.3 V 接口類型:SPI 信噪比: 電壓參考: 電源電壓-最大:3.45 V 電源電壓-最小:3.15 V 最大功率耗散: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:TCSP-48 封裝:Reel |
| THS8083CPZP | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| THS8083EVM | 制造商:Texas Instruments 功能描述:THS8083EVM - Bulk |
| THS8083T | 制造商:TI 制造商全稱:Texas Instruments 功能描述:Triple 8-Bit, 80 MSPS, 3.3-V Video and Graphics Digitizer With Digital PLL |
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