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參數資料
| 型號： | ISP1301BS |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 通用總線功能 |
| 英文描述： | Universal Serial Bus On-The-Go transceiver |
| 中文描述： | LINE TRANSCEIVER, PQCC24 |
| 封裝： | 4 X 4 MM, 0.85 MM HEIGHT, LEAD FREE AND HALOGEN FREE, PLASTIC, MO-220, SOT-616-1, HVQFN-24 |
| 文件頁數： | 44/46頁 |
| 文件大小： | 245K |
| 代理商： | ISP1301BS |
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Philips Semiconductors
ISP1301
USB OTG transceiver
Product data
Rev. 01 — 14 April 2004
44 of 46
9397 750 11355
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
[3]
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reflow
soldering with peak temperature exceeding 217
°
C
±
10
°
C measured in the atmosphere of the reflow
oven. The package body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSOP packages with a pitch (e) equal to or
larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than
0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex
foil by using a hot bar soldering process. The appropriate soldering profile can be provided on
request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
[4]
[5]
[6]
[7]
[8]
[9]
21. Revision history
Table 53:
Rev Date
01
Revision history
CPCN
20040414
Description
Product data (9397 750 11355).
-
相關PDF資料 |
PDF描述 |
|---|---|
| ISP1362 | Single-chip Universal Serial Bus On-The-Go controller |
| ISP1362BD | Single-chip Universal Serial Bus On-The-Go controller |
| ISP1362EE | Single-chip Universal Serial Bus On-The-Go controller |
| ISP1501 | Hi-Speed Universal Serial Bus peripheral transceiver |
| ISP1520 | Hi-Speed Universal Serial Bus hub controller |
相關代理商/技術參數 |
參數描述 |
|---|---|
| ISP1301BS,115 | 功能描述:射頻收發器 USB OTG TRANSCEIVER RoHS:否 制造商:Atmel 頻率范圍:2322 MHz to 2527 MHz 最大數據速率:2000 Kbps 調制格式:OQPSK 輸出功率:4 dBm 類型: 工作電源電壓:1.8 V to 3.6 V 最大工作溫度:+ 85 C 接口類型:SPI 封裝 / 箱體:QFN-32 封裝:Tray |
| ISP1301BS,118 | 功能描述:射頻收發器 DO NOT USE ORDER -G OR -S PART RoHS:否 制造商:Atmel 頻率范圍:2322 MHz to 2527 MHz 最大數據速率:2000 Kbps 調制格式:OQPSK 輸出功率:4 dBm 類型: 工作電源電壓:1.8 V to 3.6 V 最大工作溫度:+ 85 C 接口類型:SPI 封裝 / 箱體:QFN-32 封裝:Tray |
| ISP1301BS,151 | 功能描述:射頻收發器 USB OTG TRANSCEIVER RoHS:否 制造商:Atmel 頻率范圍:2322 MHz to 2527 MHz 最大數據速率:2000 Kbps 調制格式:OQPSK 輸出功率:4 dBm 類型: 工作電源電壓:1.8 V to 3.6 V 最大工作溫度:+ 85 C 接口類型:SPI 封裝 / 箱體:QFN-32 封裝:Tray |
| ISP1301BS,157 | 功能描述:射頻收發器 DO NOT USE ORDER -G OR -S PART RoHS:否 制造商:Atmel 頻率范圍:2322 MHz to 2527 MHz 最大數據速率:2000 Kbps 調制格式:OQPSK 輸出功率:4 dBm 類型: 工作電源電壓:1.8 V to 3.6 V 最大工作溫度:+ 85 C 接口類型:SPI 封裝 / 箱體:QFN-32 封裝:Tray |
| ISP1301BSFA | 功能描述:IC USB OTG TRANSCEIVER 24HVQFN RoHS:是 類別:集成電路 (IC) >> 接口 - 驅動器，接收器，收發器 系列:- 產品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:25 系列:- 類型:收發器 驅動器/接收器數:2/2 規程:RS232 電源電壓:4.5 V ~ 5.5 V 安裝類型:通孔 封裝/外殼:16-DIP（0.300"，7.62mm） 供應商設備封裝:16-PDIP 包裝:管件 |
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