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參數(shù)資料
| 型號(hào)： | N643GT5KI |
| 廠商： | Advanced Micro Devices, Inc. |
| 英文描述： | 64 Megabit (4 M x 16-Bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst Mode Flash Memory |
| 中文描述： | 64兆位（4個(gè)M x 16位）的CMOS 1.8伏，只有同時(shí)讀/寫，突發(fā)模式閃存 |
| 文件頁數(shù)： | 48/49頁 |
| 文件大小： | 382K |
| 代理商： | N643GT5KI |
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46
Am29BDS643G
25692A2 May 8, 2006
D A T A S H E E T
PHYSICAL DIMENSIONS*
VDA044—44-Ball Very Thin Fine-Pitch Ball Grid Array (FBGA) 9.2 x 8.0 mm Package
* For reference only. BSC is an ANSI standard for Basic Space Centering.
A
M
M
C
C
φ
0.05
φ
0.15
B
1.00
SD
1.00
A1 CORNER
7
7
6
φ
b
E1
D1
SE
e
BOTTOM VIEW
NF2
10 9
A
B
C
D
8 7 6 5 4 3 2 1
NF3
NF4
NF1
TOP VIEW
0.50 REF
1
-
0.50 REF
1.00-0.50
D
A
E
A1 ID
B
SIDE VIEW
A
SEATING PLANE
C
0.10
A2
A1
C
C
0.08
NF1-4
N/A
9.20 mm x 8.00 mm
PACKAGE
NOM.
-
-
-
8.00 BSC.
VDA 044
1.00
-
0.78
MAX.
9.20 BSC.
10
4
44
0.30
-
MIN.
0.64
0.20
4.50 BSC.
1.50 BSC.
0.35
0.25 BSC.
A
0.25
0.50 BSC.
ME
D
E
JEDEC
PACKAGE
SYMBOL
A
A1
A2
MD
D1
E1
φ
b
e
N
NOTE
PACKAGE OUTLINE TYPE
DEPOPULATED SOLDER BALLS
ROW MATRIX SIZE E DIRECTION
TOTAL BALL COUNT
BALL FOOTPRINT
BALL FOOTPRINT
BALL PITCH
BODY SIZE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
OVERALL THICKNESS
BALL DIAMETER
ROW MATRIX SIZE D DIRECTION
SOLDER BALL PLACEMENT
SD/SE
NOTES UNLESS OTHERWISE SPECIFIED:
1.
DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010
(EXCEPT AS NOTED).
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
5.
SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE "D"
DIRECTION. SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE
IN THE "E" DIRECTION. N IS THE TOTAL NUMBER OF SOLDER
BALLS.
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM Z .
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW. WHEN THERE IS AN ODD NUMBER
OF SOLDER BALLS IN THE OUTER ROW PARALLEL TO THE D
OR E DIMENSION, RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
8.
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| N643GT7GI | 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:64 Megabit (4 M x 16-Bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst Mode Flash Memory |
| N643GT7MI | 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:64 Megabit (4 M x 16-Bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst Mode Flash Memory |
| N6455A | 制造商:Agilent Technologies 功能描述:HARD COPY MANUAL, 4000X-SERIES OSCILLOSCOPE; Plug Type:-; Accessory Type:Hard Copy Manual; For Use With:InfiniiVision 4000 X-Series Oscilloscopes ;RoHS Compliant: NA |
| N6456A | 制造商:AGILENT TECHNOLOGIES, INC. 功能描述:Rackmount Kit for 2000 and 3000X Series Oscilloscopes 制造商:Agilent Technologies 功能描述:Bulk 制造商:Agilent Technologies 功能描述:OPTION RACK MOUNT KIT FOR X-SERIES 制造商:Agilent Technologies 功能描述:RACK MOUNT KIT; Accessory Type:Rackmount Kit; For Use With:Agilent InfiniiVision 2000X / 3000X Series Oscilloscopes ;RoHS Compliant: NA 制造商:Agilent Technologies 功能描述:Rack mount kit |
| N6457A | 制造商:AGILENT TECHNOLOGIES, INC. 功能描述:Soft Carrying Case and Front Panel Cover for 2000 and 3000X Series Scopes 制造商:Agilent Technologies 功能描述:Bulk 制造商:Agilent Technologies 功能描述:ACCESSORY SOFT CASE AND FRONT PANEL 制造商:Agilent Technologies 功能描述:ACCESSORY, SOFT CASE AND FRONT PANEL 制造商:Agilent Technologies 功能描述:SOFT CARRYING CASE AND FRONT PANEL COVER; Accessory Type:Case and Front Panel Cover; For Use With:Agilent InfiniiVision 2000X / 3000X Series Oscilloscopes ;RoHS Compliant: NA 制造商:Agilent Technologies 功能描述:Soft Carrying Case |
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