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參數(shù)資料
型號(hào): S29CL032J0RFFI110
廠商: SPANSION LLC
元件分類: PROM
英文描述: 1M X 32 FLASH 3.3V PROM, 48 ns, PBGA80
封裝: 13 X 11 MM, 1 MM PITCH, LEAD FREE, FORTIFIED, BGA-80
文件頁數(shù): 76/78頁
文件大小: 1825K
代理商: S29CL032J0RFFI110
76
S29CD-J & S29CL-J Flash Family
S29CD-J_CL-J_00_B1 September27,2006
Prel imi n ary
Ordering Information
Added quantities to packing type descriptions, restructured table for easier reference.
Modified description of read cycle 3 DQ7–DQ0.
Corrected third column heading
Added table.
Deleted OE# from section.
Changed tADVCS, tBDH specifications. Modified description for tIACC. Deleted minimum specifica-
tions for tAAVH.
Modified period for tIACC in drawing.
Colophon
The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary
industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1) for any use that
includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal
injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control,
medical life support system, missile launch control in weapon system), or (2) for any use where chance of failure is intolerable (i.e., submersible repeater and
artificial satellite). Please note that Spansion will not be liable to you and/or any third party for any claims or damages arising in connection with above-men-
tioned uses of the products. Any semiconductor device has an inherent chance of failure. You must protect against injury, damage or loss from such failures
by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other
abnormal operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under
the Foreign Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior au-
thorization by the respective government entity will be required for export of those products.
Trademarks and Notice
The contents of this document are subject to change without notice. This document may contain information on a Spansion Inc. product under development
by Spansion Inc.. Spansion Inc. reserves the right to change or discontinue work on any product without notice. The information in this document is provided
as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose, merchantability, non-infringement
of third-party rights, or any other warranty, express, implied, or statutory. Spansion Inc. assumes no liability for any damages of any kind arising out of the
use of the information in this document.
Copyright 2005-2006 Spansion Inc. All rights reserved. Spansion, the Spansion logo, MirrorBit, ORNAND, HD-SIM, and combinations thereof, are trade-
marks of Spansion Inc. Other company and product names used in this publication are for identification purposes only and may be trademarks of their re-
spective companies.
相關(guān)PDF資料
PDF描述
S29CL032J0RFFN130 1M X 32 FLASH 3.3V PROM, 48 ns, PBGA80
S29CL032J1JFAI110 1M X 32 FLASH 3.3V PROM, 54 ns, PBGA80
S29CL032J1MFAN120 1M X 32 FLASH 3.3V PROM, 54 ns, PBGA80
S29CL032J0PQAN102 1M X 32 FLASH 3.3V PROM, 54 ns, PQFP80
S29GL016A10FAI020 1M X 16 FLASH 3V PROM, 100 ns, PBGA64
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