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參數資料
型號: S29GL032M10BFIR23
廠商: SPANSION LLC
元件分類: PROM
英文描述: T528 Series - I, M, Z Case Sizes - Face Down Termination Tantalum Surface Mount Capacitor; Capacitance [nom]: 220uF; Working Voltage (Vdc)[max]: 6.3V; Capacitance Tolerance: +/-20%; Dielectric: Tantalum, Solid; ESR: 9.0mΩ; Lead Style: Surface-Mount Chip; Lead Dimensions: 7343-17; Termination: 100% Tin (Sn); Body Dimensions: 7.3mm x 4.3mm x 1.7mm; Temperature Range: -55C to +105C; Container: Tape & Reel; Qty per Container: 1,000; Features: Face Down Termination
中文描述: 2M X 16 FLASH 3V PROM, 100 ns, PBGA64
封裝: 13 X 11 MM, LEAD FREE, FORTIFIED BGA-64
文件頁數: 13/158頁
文件大小: 4695K
代理商: S29GL032M10BFIR23
August 4, 2004 S29GLxxxM_00_B1_E
S29GLxxxM MirrorBitTM Flash Family
11
Da ta shee t
Connection Diagrams
Notes:
1. Ball C5 is NC on S29GL032M.
2. Ball B8 is NC on S29GL064M and S29GL032M.
3. Ball C8 is NC on S29GL128M, S29GL064M and S29GL032M.
4. Ball D8 and Ball F1 are NC on S29GL064M (models R3, R4).
5. Ball F7 is NC on S29GL064M (model R5).
Special Package Handling Instructions
Special handling is required for Flash Memory products in moulded packages (TSOP and BGA). The package and/
or data integrity may be compromised if the package body is exposed to temperatures above 150°C for prolonged
periods of time.
A2
C2
D2
E2
F2
G2
H2
A3
C3
D3
E3
F3
G3
H3
A4
C4
D4
E4
F4
G4
H4
A5
C5
D5
E5
F5
G5
H5
A6
C6
D6
E6
F6
G6
H6
A7
C7
D7
E7
F7
G7
H7
DQ15/A-1
VSS
BYTE#
5
A16
A15
A14
A12
A13
DQ13
DQ6
DQ14
DQ7
A11
A10
A8
A9
VCC
DQ4
DQ12
DQ5
A19
A211
RESET#
WE#
DQ11
DQ3
DQ10
DQ2
A20
A18
WP#/ACC
RY/BY#
DQ9
DQ1
DQ8
DQ0
A5
A6
A17
A7
OE#
VSS
CE#
A0
A1
A2
A4
A3
A1
C1
D1
E1
F1
G1
H1
NC
VIO
4
NC
A8
C8
B2
B3
B4
B5
B6
B7
B1
B8
D8
E8
F8
G8
H8
NC
VSS
VIO
4
A233
A222
NC
64-ball Fortified BGA
Top View, Balls Facing Down
相關PDF資料
PDF描述
S29GL032M10BFIR12 MirrorBit Flash Family
S29GL032M10BFIR13 MirrorBit Flash Family
S29GL032M10BFIR30 T528 Series - I, M, Z Case Sizes - Face Down Termination Tantalum Surface Mount Capacitor; Capacitance [nom]: 220uF; Working Voltage (Vdc)[max]: 6.3V; Capacitance Tolerance: +/-20%; Dielectric: Tantalum, Solid; ESR: 12mΩ; Lead Style: Surface-Mount Chip; Lead Dimensions: 7343-17; Termination: 100% Tin (Sn); Body Dimensions: 7.3mm x 4.3mm x 1.7mm; Temperature Range: -55C to +105C; Container: Tape & Reel; Qty per Container: 1,000; Features: Face Down Termination
S29GL032M10FAIR22 MirrorBit Flash Family
S29GL032M10FAIR23 MirrorBit Flash Family
相關代理商/技術參數
參數描述
S29GL032M10BFIR30 制造商:SPANSION 制造商全稱:SPANSION 功能描述:3.0 Volt-only Page Mode Flash Memory featuring 0.23 um MirrorBit process technology
S29GL032M10BFIR32 制造商:SPANSION 制造商全稱:SPANSION 功能描述:3.0 Volt-only Page Mode Flash Memory featuring 0.23 um MirrorBit process technology
S29GL032M10BFIR33 制造商:SPANSION 制造商全稱:SPANSION 功能描述:3.0 Volt-only Page Mode Flash Memory featuring 0.23 um MirrorBit process technology
S29GL032M10BFIR40 制造商:SPANSION 制造商全稱:SPANSION 功能描述:3.0 Volt-only Page Mode Flash Memory featuring 0.23 um MirrorBit process technology
S29GL032M10BFIR42 制造商:SPANSION 制造商全稱:SPANSION 功能描述:MirrorBit Flash Family
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