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參數(shù)資料
| 型號(hào)： | S29GL032M10BFIR23 |
| 廠商： | SPANSION LLC |
| 元件分類： | PROM |
| 英文描述： | T528 Series - I, M, Z Case Sizes - Face Down Termination Tantalum Surface Mount Capacitor; Capacitance [nom]: 220uF; Working Voltage (Vdc)[max]: 6.3V; Capacitance Tolerance: +/-20%; Dielectric: Tantalum, Solid; ESR: 9.0mΩ; Lead Style: Surface-Mount Chip; Lead Dimensions: 7343-17; Termination: 100% Tin (Sn); Body Dimensions: 7.3mm x 4.3mm x 1.7mm; Temperature Range: -55C to +105C; Container: Tape & Reel; Qty per Container: 1,000; Features: Face Down Termination |
| 中文描述： | 2M X 16 FLASH 3V PROM, 100 ns, PBGA64 |
| 封裝： | 13 X 11 MM, LEAD FREE, FORTIFIED BGA-64 |
| 文件頁(yè)數(shù)： | 73/158頁(yè) |
| 文件大?。?/td> | 4695K |
| 代理商： | S29GL032M10BFIR23 |
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August 4, 2004 S29GLxxxM_00_B1_E
S29GLxxxM MirrorBitTM Flash Family
21
Da ta shee t
Ordering Information-S29GL032M
S29GL032M Standard Products
Standard products are available in several packages and operating ranges. The order number (Valid Combination)
is formed by a combination of the following:
S29GL032M
10
T
A
I
R1
2
PACKING TYPE
0= Tray
2
= 7” Tape and Reel
3
= 13” Tape and Reel
MODEL NUMBER
R0
= x8, VCC=3.0-3.6V, Uniform sector device
R1
= x8/x16, VCC=3.0-3.6V, Uniform sector device, highest address sector
protected when WP#/ACC=VIL
R2
= x8/x16, VCC=3.0-3.6V, Uniform sector device, lowest address sector
protected when WP#/ACC=VIL
R3
= x8/x16, VCC=3.0-3.6V, Top boot sector device, top two address sectors
protected when WP#/ACC=VIL
R4
= x8/x16, VCC=3.0-3.6V, Bottom boot sector device, bottom two
address sectors protected when WP#/ACC=VIL
R5
= x8/x16, VCC=3.0-3.6V, Top boot sector device, top two address sectors
protected when WP#/ACC=VIL, BGA-48P-M20 package only
R6
= x8/x16, VCC=3.0-3.6V, Bottom boot sector device, bottom two
address sectors protected when WP#/ACC=VIL BGA-48P-M20 package
only
TEMPERATURE RANGE
I
= Industrial (–40
°C to +85°C)
C
= Commercial (0
°C to +70°C)
PACKAGE MATERIAL SET
A= Standard
F= Pb-Free
B= Standard
C= Pb-Free
PACKAGE TYPE
T
= Thin Small Outline Package (TSOP) Standard Pinout
B
= Fine-pitch Ball-Grid Array Package
F
= Fortified Ball-Grid Array Package
SPEED OPTION
See Product Selector Guide and Valid Combinations
DEVICE NUMBER/DESCRIPTION
S29GL032M
32 Megabit Page-Mode Flash Memory Manufactured using 0.23 um MirrorBitTM
Process Technology, 3.0 Volt-only Read, Program, and Erase
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| S29GL032M10BFIR12 | MirrorBit Flash Family |
| S29GL032M10BFIR13 | MirrorBit Flash Family |
| S29GL032M10BFIR30 | T528 Series - I, M, Z Case Sizes - Face Down Termination Tantalum Surface Mount Capacitor; Capacitance [nom]: 220uF; Working Voltage (Vdc)[max]: 6.3V; Capacitance Tolerance: +/-20%; Dielectric: Tantalum, Solid; ESR: 12mΩ; Lead Style: Surface-Mount Chip; Lead Dimensions: 7343-17; Termination: 100% Tin (Sn); Body Dimensions: 7.3mm x 4.3mm x 1.7mm; Temperature Range: -55C to +105C; Container: Tape & Reel; Qty per Container: 1,000; Features: Face Down Termination |
| S29GL032M10FAIR22 | MirrorBit Flash Family |
| S29GL032M10FAIR23 | MirrorBit Flash Family |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| S29GL032M10BFIR30 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:3.0 Volt-only Page Mode Flash Memory featuring 0.23 um MirrorBit process technology |
| S29GL032M10BFIR32 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:3.0 Volt-only Page Mode Flash Memory featuring 0.23 um MirrorBit process technology |
| S29GL032M10BFIR33 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:3.0 Volt-only Page Mode Flash Memory featuring 0.23 um MirrorBit process technology |
| S29GL032M10BFIR40 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:3.0 Volt-only Page Mode Flash Memory featuring 0.23 um MirrorBit process technology |
| S29GL032M10BFIR42 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:MirrorBit Flash Family |
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