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參數資料
型號: S29GL032M10BFIR23
廠商: SPANSION LLC
元件分類: PROM
英文描述: T528 Series - I, M, Z Case Sizes - Face Down Termination Tantalum Surface Mount Capacitor; Capacitance [nom]: 220uF; Working Voltage (Vdc)[max]: 6.3V; Capacitance Tolerance: +/-20%; Dielectric: Tantalum, Solid; ESR: 9.0mΩ; Lead Style: Surface-Mount Chip; Lead Dimensions: 7343-17; Termination: 100% Tin (Sn); Body Dimensions: 7.3mm x 4.3mm x 1.7mm; Temperature Range: -55C to +105C; Container: Tape & Reel; Qty per Container: 1,000; Features: Face Down Termination
中文描述: 2M X 16 FLASH 3V PROM, 100 ns, PBGA64
封裝: 13 X 11 MM, LEAD FREE, FORTIFIED BGA-64
文件頁數: 64/158頁
文件大小: 4695K
代理商: S29GL032M10BFIR23
156
S29GLxxxM MirrorBitTM Flash Family
S29GLxxxM_00_B1_E August 4, 2004
Data she e t
Updated the R3, R4 column replacing -04 and -03 designators with -R4 and -R3 respectively.
Word Program Command Sequence
Included statements documenting word programming support for backward compatibility with existing Flash
drivers.
Physical Dimensions
Removed the BGA-80P-M02 diagram.
Revision A+3 (February 26, 2004)
Distinctive Characteristics
Corrected typo in the Flexible Sector Architecture section.
Revision A+4 (March 24, 2004)
CMOS Compatible
Removed VCC from Max for VOL.
Erase and Program Operations-S29GL256M only
Corrected unit typos.
Erase and Program Operations-S29GL128M only
Corrected the minimum Data Setup Time.
Alternate CE# Controlled Erase and Program Operations-S29GL128M
Corrected the minimum CE# Pulse width.
TSOP Pin and BGA Package Capacitance: Pkg types TB, TC, BB, BC
Added CIN3.
Connection Diagrams
40-pin standard TSOP: Corrected pin 30 to be VIO.
48-pin standard TSOP: Added superscripts to designators for pin 9, 13, 14, 15 and 47. Changed pin 13 to A21.
Added two notes below illustration.
56-pin standard TSOP: Added superscripts to designators for pin 1, 2 and 12. Changed pin 56 to NC. Added three
notes below illustration.
64-ball Fortified BGA: Corrected ball D8 to be VIO. Added superscripts to designators for ball D8, F7, and F1.
Added two notes below illustration.
63-ball Fine-pitch BGA: Added superscript to designator for Ball H7. Added one note below illustration. Added con-
nection diagrams for S29GL064M (model R0) and S29GL032M (model R0).
Pin Description
Added VIO description.
Logic Symbols
Added VIO on all models except R3 and R4.
Figure 3 Write Buffer Programming Operation
Corrected the DQ locations and added callouts to notes one through three.
DC Characteristics
Corrected test conditions for ICC6.
相關PDF資料
PDF描述
S29GL032M10BFIR12 MirrorBit Flash Family
S29GL032M10BFIR13 MirrorBit Flash Family
S29GL032M10BFIR30 T528 Series - I, M, Z Case Sizes - Face Down Termination Tantalum Surface Mount Capacitor; Capacitance [nom]: 220uF; Working Voltage (Vdc)[max]: 6.3V; Capacitance Tolerance: +/-20%; Dielectric: Tantalum, Solid; ESR: 12mΩ; Lead Style: Surface-Mount Chip; Lead Dimensions: 7343-17; Termination: 100% Tin (Sn); Body Dimensions: 7.3mm x 4.3mm x 1.7mm; Temperature Range: -55C to +105C; Container: Tape & Reel; Qty per Container: 1,000; Features: Face Down Termination
S29GL032M10FAIR22 MirrorBit Flash Family
S29GL032M10FAIR23 MirrorBit Flash Family
相關代理商/技術參數
參數描述
S29GL032M10BFIR30 制造商:SPANSION 制造商全稱:SPANSION 功能描述:3.0 Volt-only Page Mode Flash Memory featuring 0.23 um MirrorBit process technology
S29GL032M10BFIR32 制造商:SPANSION 制造商全稱:SPANSION 功能描述:3.0 Volt-only Page Mode Flash Memory featuring 0.23 um MirrorBit process technology
S29GL032M10BFIR33 制造商:SPANSION 制造商全稱:SPANSION 功能描述:3.0 Volt-only Page Mode Flash Memory featuring 0.23 um MirrorBit process technology
S29GL032M10BFIR40 制造商:SPANSION 制造商全稱:SPANSION 功能描述:3.0 Volt-only Page Mode Flash Memory featuring 0.23 um MirrorBit process technology
S29GL032M10BFIR42 制造商:SPANSION 制造商全稱:SPANSION 功能描述:MirrorBit Flash Family
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