- 您現在的位置：買賣IC網 > PDF目錄98215 > TFP9431CPAP (TEXAS INSTRUMENTS INC) SPECIALTY CONSUMER CIRCUIT, PQFP64 PDF資料下載
參數資料
| 型號： | TFP9431CPAP |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 消費家電 |
| 英文描述： | SPECIALTY CONSUMER CIRCUIT, PQFP64 |
| 封裝： | 10 X 10 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, POWER, THERMALLY ENHANCED, PLASTIC, TQFP-64 |
| 文件頁數： | 8/18頁 |
| 文件大小： | 241K |
| 代理商： | TFP9431CPAP |
TFP9431
PanelBus
DVI RECEIVER WITH TRIPLE DAC
SLDS122A – MARCH 2000 – REVISED JUNE 2000
16
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
TFP9431 output driver configurations (continued)
Sync Detect. The TFP9431 offers an output, SCDT to indicate link activity. The TFP9431 monitors activity on
DE to determine if the link is active. When 1 million (1e6) pixel clock periods pass without a transition on DE,
the TFP9431 considers the link inactive and SCDT is driven low. While SCDT is low, if two DE transitions are
detected within 1600 pixel clock periods, the link will be considered active and SCDT is pulled high.
SCDT can be used to signal a system power management circuit to initiate a system power down when the link
is considered inactive. The SCDT can also be tied directly to the TFP9431 PDO input to power down the output
drivers when the link is inactive. It is not recommended to use the SCDT to drive the PD input since, once in
complete power-down, the analog inputs are ignored and the SCDT state will not change. An external system
power management circuit to drive PD is preferred.
TI PowerPAD
64-TQFP package
The TFP9431 is packaged in TI’s thermally enhanced PowerPAD
64 TQFP packaging. The PowerPAD
package is a 10 mm
× 10 mm × 1.4 mm TQFP outline with 0.5mm lead-pitch. The PowerPAD package has
a specially designed die mount pad that offers improved thermal capability over typical TQFP packages of the
same outline. The TI 64-TQFP PowerPAD
package offers a back-side solder plane that connects directly to
the die mount pad for enhanced thermal conduction. The system designer has the option to solder this back
side plane to a thermal/ground plane on the PCB. Since the die pad is electrically connected to the TFP9431
chip substrate and hence ground, the back side PowerPAD
connection to a PCB ground plane can improve
ground bounce and power-supply noise.
The connection of the PowerPAD
to a PCB thermal/ground plane is purely optional.
Table 1 outlines the thermal properties of the TI 64-TQFP PowerPAD
package. The 64-TQFP non-
PowerPAD
package is included only for reference.
Table 1. TI 64-TQPF (10
× 10 × 1.4 mm)/0.5 mm Lead Pitch
PARAMETER
WITHOUT
PowerPAD
PowerPAD
NOT CONNECTED TO PCB
THERMAL PLANE
PowerPAD
CONNECTED TO PCB
THERMAL PLANE
Theta-JA,
45
°C/W
27.3
°C/W
17.3
°C/W
Theta-JC,
3.11
°C/W
0.12
°C/W
0.12
°C/W
Maximum power dissipation,,§
1.6 W
2.7 W
4.3 W
Maximum TFP401/401A pixel rate
TBD
Specified with 2 oz. Cu PCB plating.
Airflow is at 0 LFM (no airflow)
§ Measured at ambient temperature, TA = 70°C.
相關PDF資料 |
PDF描述 |
|---|---|
| TG355ENK-7916 | 8.15 MHz, LOW PASS FILTER |
| TH355BDI-4957 | 4.43 MHz, BAND PASS FILTER |
| TH355LDK-7915 | 8.15 MHz, LOW PASS FILTER |
| TH355LNK-4550 | 10 MHz, LOW PASS FILTER |
| TH355LNK-4867 | 5 MHz, LOW PASS FILTER |
相關代理商/技術參數 |
參數描述 |
|---|---|
| TFP-AA-10T-13 | 制造商:DIALIGHT 制造商全稱:Dialight Corporation 功能描述:Tactical Composite Front Park Turn Light |
| TFPAA13B13 | 制造商:Dialight 功能描述: |
| TFPAA13D13 | 制造商:Dialight 功能描述: |
| TFPAA13T13 | 制造商:Dialight 功能描述: |
| TFP-AA-13T-13 | 制造商:DIALIGHT 制造商全稱:Dialight Corporation 功能描述:Tactical Composite Front Park Turn Light |
發布緊急采購，3分鐘左右您將得到回復。