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參數資料
| 型號： | TRCV0110G |
| 英文描述： | ATM/SONET DEMULTIPLEXER|BIPOLAR|BGA|177PIN|PLASTIC |
| 中文描述： | 的ATM / SONET的分路器|雙極|的BGA | 177PIN |塑料 |
| 文件頁數： | 22/26頁 |
| 文件大小： | 476K |
| 代理商： | TRCV0110G |
22
Agere Systems Inc.
Data Sheet
March 28, 2002
Clock Recovery, 1:16 Data Demultiplexer
TRCV0110G 10 Gbits/s Limiting Amplifier
Packaging Characteristics
Package Crush Characteristics
Table 19. Crush Specifications
Additional test information available on request.
CBGA Package Information
The package used for the TRCV0110G devices is a ceramic ball grid array (CBGA). The substrate is 99.6%
alumina (Al2O3) material. The standoff height is accomplished by using 0.013 in. diameter copper silver (CuAg)
balls, which are attached using a eutectic braze to the thin film metal pads on the substrate. After brazing the balls
have a diameter at the braze fillet of 0.016 in. (at the interface of the ball and substrate), but still maintain their
height of 0.013 in. for standoff height.
PWB Design Information
The layout of the bare PWB should use a 0.016 in. diameter pad. The pad should be defined by the copper and not
by solder mask. (The only copper leading away from the pad should be the trace connected to it; the pad should
not be part of a large ground plane unless only connected to the ground plane by a single trace.) Avoid placement
of vias in the pads used for ball attachment on the PWB. Vias should be connected by a trace (or tear dropped)
with a sufficient dam of solder mask to prevent solder from wicking into the via and away from the ball/PWB solder
joint.
The stencil opening should be designed at 0.016 in. as well, to match up with the CBGA pads.
Device Code
TRCV0110G
Package
177-ball CBGA
Dimensions
14 mm x 14 mm
Conditions
Without pad
With pad (0.040 in.)
Min
—
—
Typ
25
25
Max
—
—
Unit
lbs
lbs
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