
ADV7180
TIMING SPECIFICATIONS
Guaranteed by characterization. At A
VDD
= 1.71 V to 1.89 V, D
VDD
= 1.65 V to 2.0 V, D
VDDIO
= 3.0 V to 3.6 V, P
VDD
= 1.65 V to 2.0 V,
specified at operating temperature range, unless otherwise noted.
Rev. A | Page 9 of 112
Table 4.
Parameter
SYSTEM CLOCK AND CRYSTAL
Nominal Frequency
Frequency Stability
I
2
C PORT
SCLK Frequency
SCLK Minimum Pulse Width High
SCLK Minimum Pulse Width Low
Hold Time (Start Condition)
Setup Time (Start Condition)
SDA Setup Time
SCLK and SDA Rise Times
SCLK and SDA Fall Times
Setup Time for Stop Condition
RESET FEATURE
Reset Pulse Width
CLOCK OUTPUTS
LLC1 Mark Space Ratio
DATA AND CONTROL OUTPUTS
Data Output Transitional Time
Symbol
t
1
t
2
t
3
t
4
t
5
t
6
t
7
t
8
t
9
:t
10
t
11
Test Conditions
Negative clock edge to start of valid data
(t
ACCESS
= t
10
– t
11
)
End of valid data to negative clock edge
(t
HOLD
= t
9
+ t
12
)
Min
0.6
1.3
0.6
0.6
100
5
45:55
Typ
28.6363
0.6
Max
±50
400
300
300
55:45
3.6
Unit
MHz
ppm
kHz
μs
μs
μs
μs
ns
ns
ns
μs
ms
% duty cycle
ns
Data Output Transitional Time
t
12
2.4
ns
ANALOG SPECIFICATIONS
Guaranteed by characterization. At A
VDD
= 1.71 V to 1.89 V, D
VDD
= 1.65 V to 2.0 V, D
VDDIO
= 3.0 V to 3.6 V, P
VDD
= 1.65 V to 2.0 V,
specified at operating temperature range, unless otherwise noted.
Table 5.
Parameter
CLAMP CIRCUITRY
External Clamp Capacitor
Input Impedance
Large-Clamp Source Current
Large-Clamp Sink Current
Fine Clamp Source Current
Fine Clamp Sink Current
Test Conditions
Clamps switched off
Min
Typ
0.1
10
0.4
0.4
10
10
Max
Unit
μF
MΩ
mA
mA
μA
μA
THERMAL SPECIFICATIONS
Table 6.
Parameter
THERMAL CHARACTERISTICS
Junction-to-Ambient Thermal
Resistance (Still Air)
Junction-to-Case Thermal Resistance
Symbol
θ
JA
Test Conditions
4-layer PCB with solid ground plane,
40-lead LFCSP
4-layer PCB with solid ground plane,
40-lead LFCSP
4-layer PCB with solid ground plane,
64-lead LQFP
4-layer PCB with solid ground plane,
64-lead LQFP
Min
Typ
30
Max
Unit
°C/W
θ
JC
3
°C/W
Junction-to-Ambient Thermal
Resistance (Still Air)
Junction-to-Case Thermal Resistance
θ
JA
47
°C/W
θ
JC
11.1
°C/W