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參數資料
| 型號： | ISP1761 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Hi-Speed Universal Serial Bus On-The-Go controller |
| 中文描述： | 高速通用串行總線和On - The - Go控制器 |
| 文件頁數： | 147/158頁 |
| 文件大?。?/td> | 724K |
| 代理商： | ISP1761 |
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9397 750 13258
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 — 12 January 2005
147 of 158
Philips Semiconductors
ISP1761
Hi-Speed USB OTG controller
17. Soldering
17.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account of
soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is recommended.
17.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 seconds and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215
°
C to 270
°
C depending on solder paste
material. The top-surface temperature of the packages should preferably be kept:
below 225
°
C (SnPb process) or below 245
°
C (Pb-free process)
–
for all BGA, HTSSON..T and SSOP..T packages
–
for packages with a thickness
≥
2.5 mm
–
for packages with a thickness < 2.5 mm and a volume
≥
350 mm
3
so called
thick/large packages.
below 240
°
C (SnPb process) or below 260
°
C (Pb-free process) for packages with a
thickness < 2.5 mm and a volume < 350 mm
3
so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
17.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal results:
Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
For packages with leads on two sides and a pitch (e):
–
larger than or equal to 1.27 mm, the footprint longitudinal axis is
preferred
to be
parallel to the transport direction of the printed-circuit board;
相關PDF資料 |
PDF描述 |
|---|---|
| ISP1761BE | Hi-Speed Universal Serial Bus On-The-Go controller |
| ISP1761ET | Hi-Speed Universal Serial Bus On-The-Go controller |
| ISP2100A | Telecommunication IC |
| ISP2100BN4 | Microprocessor |
| ISP2300 | Controller Miscellaneous - Datasheet Reference |
相關代理商/技術參數 |
參數描述 |
|---|---|
| ISP1761BE | 功能描述:USB 接口集成電路 USB HS OTG CTRLR RoHS:否 制造商:Cypress Semiconductor 產品:USB 2.0 數據速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:WLCSP-20 |
| ISP1761BE,518 | 功能描述:USB 接口集成電路 USB HS OTG CONTROLLER RoHS:否 制造商:Cypress Semiconductor 產品:USB 2.0 數據速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:WLCSP-20 |
| ISP1761BE,551 | 功能描述:USB 接口集成電路 DO NOT USE ORDER -T OR NO "-" RoHS:否 制造商:Cypress Semiconductor 產品:USB 2.0 數據速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:WLCSP-20 |
| ISP1761BE,557 | 功能描述:USB 接口集成電路 USB HS OTG CTRLR RoHS:否 制造商:Cypress Semiconductor 產品:USB 2.0 數據速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:WLCSP-20 |
| ISP1761BE518 | 制造商:ST-Ericsson 功能描述:IC CONTROLLER USB OTG 128LQFP |
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