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參數資料
| 型號： | A40MX04-VQG80A |
| 元件分類： | FPGA |
| 英文描述： | FPGA, 6000 GATES, PQFP80 |
| 封裝： | PLASTIC, VQFP-80 |
| 文件頁數： | 11/78頁 |
| 文件大?。?/td> | 515K |
| 代理商： | A40MX04-VQG80A |
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40MX and 42MX Automotive FPGA Families
v3.0
1-15
Junction Temperature
The temperature variable in the Designer software refers
to
the
junction
temperature,
not
the
ambient
temperature. This is an important distinction because the
heat generated from dynamic power consumption is
usually hotter than the ambient temperature. EQ 1-3 can
be used to calculate junction temperature.
Junction Temperature =
T + T
a (1)
EQ 1-3
Where:
Ta = Ambient Temperature
T = Temperature gradient between junction (silicon)
and ambient
T = θ
ja * P
P = Power
θ
ja = Junction to ambient of package. θja numbers are
located in the "Package Thermal Characteristics" section.
Package Thermal Characteristics
The device junction-to-case thermal characteristic is
θ
jc,
and the junction-to-ambient air characteristic is
θ
ja. The
thermal characteristics for
θ
ja are shown with two
different air flow rates.
Maximum junction temperature is 150°C.
A sample calculation of the absolute maximum power
dissipation allowed for a PQFP 160-pin package at
automotive temperature is as follows:
Table 1-6 Package Thermal Characteristics
Plastic Packages
Pin Count
θ
jc
θ
ja
Units
Still Air
1.0 m/s
200 ft./min.
2.5 m/s
500 ft./min.
Plastic Quad Flat Pack
100
12.0
27.8
23.4
21.2
°C/W
Plastic Quad Flat Pack
160
10.0
26.2
22.8
21.1
°C/W
Plastic Quad Flat Pack
208
8.0
26.1
22.5
20.8
°C/W
Plastic Quad Flat Pack
240
8.5
25.6
22.3
20.8
°C/W
Plastic Leaded Chip Carrier
68
13.0
25.0
21.0
19.4
°C/W
Plastic Leaded Chip Carrier
84
12.0
22.5
18.9
17.6
°C/W
Thin Plastic Quad Flat Pack
176
11.0
24.7
19.9
18.0
°C/W
Very Thin Plastic Quad Flat Pack
80
12.0
38.2
31.9
29.4
°C/W
Very Thin Plastic Quad Flat Pack
100
10.0
35.3
29.4
27.1
°C/W
Max. junction temp. (°C) – Max. automotive temp.
θ
ja
(°C/W)
-----------------------------------------------------------------------------------------------------------------------------------
150°C – 125°C
26.2
°C/W
---------------------------------------
0.95
W
==
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相關代理商/技術參數 |
參數描述 |
|---|---|
| A40MX04-VQG80I | 功能描述:IC FPGA MX SGL CHIP 6K 80-VQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現場可編程門陣列） 系列:MX 標準包裝:90 系列:ProASIC3 LAB/CLB數:- 邏輯元件/單元數:- RAM 位總計:36864 輸入/輸出數:157 門數:250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應商設備封裝:256-FPBGA（17x17） |
| A40MX04-VQG80M | 制造商:Microsemi Corporation 功能描述:FPGA 6K GATES 547 CELLS 83MHZ/139MHZ 0.45UM 3.3V/5V 80VQFP - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA MX SGL CHIP 6K 80-VQFP 制造商:Microsemi Corporation 功能描述:IC FPGA 69 I/O 80VQFP |
| A40MX09-PL84 | 制造商:Microsemi SOC Products Group 功能描述: |
| A40P24 | 制造商:Pentair Technical Products / Hoffman 功能描述:Panel 37.00x21.00 fits 40.00x2 White, fits 40x24, Steel |
| A-40P24 | 制造商:Pentair Technical Products / Hoffman 功能描述:Panel 37.00x21.00 fits 40.00x2 制造商:PENTAIR TECNICAL PRODCUTS 功能描述:Panel 37.00x21.00 fits 40.00x2 |
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