
Rev. B
|
Page 38 of 44
|
May 2005
ADSP-21266
ENVIRONMENTAL CONDITIONS
The ADSP-21266 processor is rated for performance under
T
AMB
environmental conditions specified in the
Recommended
Operating Conditions on Page 15
.
THERMAL CHARACTERISTICS
Table 33
and
Table 34
airflow measurements comply with
JEDEC standards JESD51-2 and JESD51-6 and the junction-to-
board measurement complies with JESD51-8. The junction-to-
case measurement complies with MIL-STD-883. All measure-
ments use a 2S2P JEDEC test board.
To determine the junction temperature of the device while on
the application PCB, use
where:
T
J
= junction temperature (
°
C)
T
CASE
= case temperature (
°
C) measured at the top center of the
package
Ψ
JT
= junction-to-top (of package) characterization parameter is
the typical value from
Table 33
and
Table 34
.
P
D
= power dissipation (see EE Note No. 216)
Values of
θ
JA
are provided for package comparison and PCB
design considerations.
θ
JA
can be used for a first order approxi-
mation of T
J
by the equation
where:
T
A
= ambient temperature
°
C
Values of
θ
JC
are provided for package comparison and PCB
design considerations when an external heat sink is required.
Figure 33. Typical Output Delay or Hold vs. Load Capacitance
(at Ambient Temperature)
LOADCAPACITANCE(pF)
0
200
50
100
150
10
8
O
–4
6
0
4
2
–2
Y=0.0488X–1.5923
T
J
T
CASE
Ψ
JT
P
D
×
(
)
+
=
T
J
T
A
θ
JA
P
D
×
(
)
+
=
Table 33. Thermal Characteristics for 136-Ball BGA
Parameter
θ
JA
θ
JMA
θ
JMA
θ
JC
Ψ
JT
Ψ
JMT
Ψ
JMT
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Typical
31.0
27.3
26.0
6.99
0.16
0.30
0.35
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Table 34. Thermal Characteristics for 144-Lead LQFP
Parameter
θ
JA
θ
JMA
θ
JMA
θ
JC
Ψ
JT
Ψ
JMT
Ψ
JMT
Typical
32.5
28.9
27.8
7.8
0.5
0.8
1.0
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s