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參數資料
| 型號： | UJA1065 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | High-speed CAN/LIN fail-safe system basis chip |
| 中文描述： | 高速的CAN / LIN故障防護系統基礎芯片 |
| 文件頁數： | 63/67頁 |
| 文件大小： | 285K |
| 代理商： | UJA1065 |
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9397 750 14409
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Objective data sheet
Rev. 01 — 10 August 2005
63 of 67
Philips Semiconductors
UJA1065
High-speed CAN/LIN fail-safe system basis chip
–
smaller than 1.27 mm, the footprint longitudinal axis
must
be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
For packages with leads on four sides, the footprint must be placed at a 45
°
angle to
the transport direction of the printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250
°
C
or 265
°
C, depending on solder material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most
applications.
11.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage
(24 V or less) soldering iron applied to the flat part of the lead. Contact time must be
limited to 10 seconds at up to 300
°
C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 seconds to 5 seconds between 270
°
C and 320
°
C.
11.5 Package related soldering information
[1]
For more detailed information on the BGA packages refer to the (LF)BGA Application Note(AN01026);
order a copy from your Philips Semiconductors sales office.
[2]
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal or
external package cracks may occur due to vaporization of the moisture in them (the so called popcorn
effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit
Packages; Section: Packing Methods
[3]
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with
peak temperature exceeding 217
°
C
±
10
°
C measured in the atmosphere of the reflow oven. The package
body peak temperature must be kept as low as possible.
Table 28:
Package
[1]
Suitability of surface mount IC packages for wave and reflow soldering methods
Soldering method
Wave
BGA, HTSSON..T
[3]
, LBGA, LFBGA, SQFP,
SSOP..T
[3]
, TFBGA, VFBGA, XSON
DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP,
HSQFP, HSSON, HTQFP, HTSSOP, HVQFN,
HVSON, SMS
PLCC
[5]
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO, VSSOP
CWQCCN..L
[8]
, PMFP
[9]
, WQCCN..L
[8]
Reflow
[2]
suitable
not suitable
not suitable
[4]
suitable
suitable
not recommended
[5] [6]
not recommended
[7]
not suitable
suitable
suitable
suitable
not suitable
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相關代理商/技術參數 |
參數描述 |
|---|---|
| UJA1065TW | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:High-speed CAN/LIN fail-safe system basis chip |
| UJA1065TW/3V0 | 功能描述:網絡控制器與處理器 IC HI SPEED CAN SYSTEM RoHS:否 制造商:Micrel 產品:Controller Area Network (CAN) 收發器數量: 數據速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray |
| UJA1065TW/3V0,512 | 功能描述:CAN 接口集成電路 HI SPEED CAN SYSTEM RoHS:否 制造商:Texas Instruments 類型:Transceivers 工作電源電壓:5 V 電源電流: 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:SOIC-8 封裝:Tube |
| UJA1065TW/3V0,518 | 功能描述:網絡控制器與處理器 IC HI SPEED CAN SYSTEM RoHS:否 制造商:Micrel 產品:Controller Area Network (CAN) 收發器數量: 數據速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray |
| UJA1065TW/3V0512 | 制造商:NXP Semiconductors 功能描述:CONTROLLER SYS CAN/LIN 3V 32HTSSOP |
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