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參數(shù)資料
| 型號： | UJA1065 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | High-speed CAN/LIN fail-safe system basis chip |
| 中文描述： | 高速的CAN / LIN故障防護系統(tǒng)基礎(chǔ)芯片 |
| 文件頁數(shù)： | 64/67頁 |
| 文件大小： | 285K |
| 代理商： | UJA1065 |
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9397 750 14409
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Objective data sheet
Rev. 01 — 10 August 2005
64 of 67
Philips Semiconductors
UJA1065
High-speed CAN/LIN fail-safe system basis chip
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8]
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
[9]
Hot bar soldering or manual soldering is suitable for PMFP packages.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| UJA1065TW | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:High-speed CAN/LIN fail-safe system basis chip |
| UJA1065TW/3V0 | 功能描述:網(wǎng)絡(luò)控制器與處理器 IC HI SPEED CAN SYSTEM RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray |
| UJA1065TW/3V0,512 | 功能描述:CAN 接口集成電路 HI SPEED CAN SYSTEM RoHS:否 制造商:Texas Instruments 類型:Transceivers 工作電源電壓:5 V 電源電流: 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:SOIC-8 封裝:Tube |
| UJA1065TW/3V0,518 | 功能描述:網(wǎng)絡(luò)控制器與處理器 IC HI SPEED CAN SYSTEM RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray |
| UJA1065TW/3V0512 | 制造商:NXP Semiconductors 功能描述:CONTROLLER SYS CAN/LIN 3V 32HTSSOP |
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