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參數(shù)資料
型號(hào)： TLV320DAC3100IRHBT
廠商： TEXAS INSTRUMENTS INC
元件分類： DAC
英文描述： DAC WITH PROGRAMMABLE PLL, PQCC32
封裝： 5 X 5 MM, GREEN, PLASTIC, QFN-32
文件頁數(shù)： 34/97頁
文件大小： 1134K
代理商： TLV320DAC3100IRHBT
SLAS671 – FEBRUARY 2010
www.ti.com
Table 2-1. TERMINAL FUNCTIONS (continued)
TERMINAL
I/O
DESCRIPTION
NAME
NO.
MCLK
8
I
Exterrnal master clock
MICBIAS
12
–
Microphone bias for external microphone
NC
4, 15
I
No connecton
RESET
31
I
Device reset
SCL
10
I/O
I2C control bus clock input
SDA
9
I/O
I2C control bus data input
SPKM
19, 23
O
Cass-D speaker driver inverting output
SPKP
22, 26
O
Class-D speaker driver noninverting output
SPKVDD
21, 24
–
Class-D speaker driver power supply
SPKVSS
20, 25
–
Class-D speaker driver power-supply ground
Volume control or headphone detection. Note that microphone detection is also available on
VOL/MICDET
11
I
devices that have an ADC.
WCLK
6
I/O
Audio serial word clock
3
ELECTRICAL SPECIFICATIONS
3.1
Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
VALUE
UNIT
AVDD to AVSS
–0.3 to 3.9
V
DVDD to DVSS
–0.3 to 2.5
V
HPVDD to HPVSS
–0.3 to 3.9
V
SPKVDD to SPKVSS
–0.3 to 6
V
IOVDD to IOVSS
–0.3 to 3.9
V
Digital input voltage
IOVSS – 0.3 to IOVDD + 0.3
V
Analog input voltage
AVSS – 0.3 to AVDD + 0.3
V
Operating temperature range
–40 to 85
°C
Storage temperature range
–55 to 150
°C
Junction temperature (TJ Max)
105
°C
Power dissipation
(TJ Max – TA)/RqJA
W
RqJA thermal impedance (with thermal pad soldered to board)
35
°C/W
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Table 3-1. System Thermal Characteristics(1)
Power Rating at 25°C
Derating Factor
Power Rating at 70°C
Power Rating at 85°C
2.3 W
28.57 mW/°C
1 W
0.6 W
(1)
This data was taken using 2-oz. (0.071-mm thick) trace and copper pad that is soldered to a JEDEC high-K, standard 4-layer 3-in. ×
3-in. (7.62-cm × 7.62-cm) PCB.
4
ELECTRICAL SPECIFICATIONS
Copyright 2010, Texas Instruments Incorporated
Product Folder Link(s): TLV320DAC3100
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